One-Stop Product Supply
Annual supply capacity at the million-unit level, covering everything from semiconductor inspection to mobile phone modules, meeting your needs across different application scenarios—no need for multiple sourcing.
The Path of Advancement: From "Precision Drive" to "Core Competitiveness"
Projected market size by 2028 – your product can secure a share.
Global market by 2030 – technology upgrade is an inevitable trend.
67% of manufacturers have already upgraded – why are you still waiting?
A low dielectric constant results in low device capacitance and reduced driving power consumption A large driving displacement leads to faster focusing speeds A low sintering temperature enables multilayer co-firing, thereby facilitating ultra-low driving voltages.
| Selection Criteria | YGP-51G (Medium Material) | YGP-P84 (Hard Material) |
| Electrical Properties (Tolerance ±10%) | ||
| Dielectric Constant ε33T | 1800 | 1600 |
| Dielectric Loss tgδ (%) | 1.50% | 0.48% |
| Electromechanical Properties (Tolerance ±5%) | ||
| Electromechanical Coupling Coefficient Kp | 0.62 | 0.54 |
| Electromechanical Coupling Coefficient K33 | 0.73 | 0.56 |
| Piezoelectric Constant d33 (10⁻¹² C/N) | 510 | 450 |
| Physical Properties (Tolerance ±5%) | ||
| Mechanical Quality Factor Qm | 50 | 300 |
| Curie Temperature Tc (°C) | 360 | 320 |
| Sintering Temperature Ts (°C) | 1200 | 1200 |
| Strain (@20 kV/cm) | 1.5‰ | 1.15‰ |
If your priority is focusing speed and multi-layer low-voltage driving, opt for the YGP-51G.
If your priority is low power consumption, minimal heat generation, and high stability, opt for the YGP-P84.
Theoretically unlimited precision: depends on drive control and testing environment
Ideal for You If: High Resolution and High Thrust Are Required
Travel Range: depends on the length of the moving part | Cost: sensitive
Ideal for You If: You require unlimited travel range and a simple structural design.
The primary models for Inertial Piezoelectric Drive Modules are the 3×3 and 2×2 series, typically featuring stack heights ranging from 4 to 10 mm.
Ultra-compact, chip-scale units—such as the 1×1 and 1.5×1.5 series—are primarily utilized in small-scale consumer devices (e.g., mobile phones and smartwatches) where spatial constraints are extremely stringent.
Based on your optical resolution requirements:
Matched to your lens group weight + damping
Balance against the cost of your drive circuitry.
Consider your system bandwidth requirements.
Your Environmental Adaptability Requirements
Matches the Lifespan of Your Device
Annual supply capacity at the million-unit level, covering everything from semiconductor inspection to mobile phone modules, meeting your needs across different application scenarios—no need for multiple sourcing.
We provide a one-stop solution covering “ceramic element + driver + algorithm + debugging” to help your products launch earlier and seize market opportunities.
We provide process optimization support prior to mass production to enhance the technical competitiveness of your products.
Dedicated production lines and modular design help you reduce overall costs and increase product profitability.
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