Precisely covers the mainstream temperature range
Deeply optimized for the temperature range from room temperature to 130°C, covering over 90% of testing requirements and avoiding performance waste.
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Severe thermal drift restricts displacement resolution to the nanometer scale at best, making it insufficient for sub-nanometer measurement requirements.
Poor output stability, severe product homogenization, and over-engineering for high-temperature applications (resulting in high cost and reduced response speed).
Frictionless rigid displacement with a resolution of 0.01 nm captures the initial yield point of the material.
Microsecond-level response, high-speed dynamic loading, and data acquisition frequency exceeding 100kHz.
For the same volume, the thrust is significantly higher than that of electromagnetic drives, resulting in minimal system deformation error under heavy loads.
| Selection Dimensions | Key Technical Parameters | Recommended Requirements |
| Displacement Resolution and Stroke | Resolution < 0.1nm, Stroke 0-30μm or greater | Ensure the instrument can measure both ultrathin films and bulk materials with deep indentations |
| Load and Stiffness | Output Force: Millinewtons to Newtons Frame Flexibility: < 5 nm/mN | Critical to the accuracy of hardness and modulus calculations |
| Operating Temperature | Ambient Temperature to 130℃ | Covers most polymer materials, composite materials, and electronic packaging materials |
| Dynamic Performance | Data Acquisition Frequency ≥ 100kHz | Affects the accuracy of time-related performance tests such as material creep and stress relaxation |
It has high output force, high stiffness, and fast response. The displacement is relatively small (typically tens of micrometers).
Capable of withstanding bidirectional forces and exhibiting excellent dynamic performance. Relatively complex structure and high cost
Large displacement (up to the millimeter scale) , but low output force and low stiffness
Compact structure, enabling multi-degree-of-freedom motion. Moderate output force.
Deeply optimized for the temperature range from room temperature to 130°C, covering over 90% of testing requirements and avoiding performance waste.
Multi-layer co-firing process, low hysteresis, high resolution, displacement resolution can reach sub-nanometer level
Features an optimized internal insulation and mechanical preload structure, ensuring zero performance degradation under long-term dynamic loading
From standard stacks to prestressed actuators, matching the upgrade needs of different brands of indenters
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